The contact wiping action on the PCB (.007" - .014" distance) reduces resistance by removing oxidation on the pad.
Z Series Contact Wipe
Wipe Distance: .007" - .014
The Competition's Twist Pin Contact
Designed for board-to-board applications with board spacing between 0.100" and 0.350". Z Series uses a patented z-axis contact system that is specifically engineered to meet AirBorn's strict performance & reliability requirements.
Solid Connection Through Compression
Z Series Uncompressed
Z Series Fully Compressed
Reduced resistance with a single-piece contact construction vs. designs with multiple components.
Patented 1-Piece Contact System
Design intricate, space-saving 3D routed flexible circuit assemblies with Z Series connectors.
Z Series & Flex —
A Perfect Marriage
Options for multiple contacts-per-cavity means redundancy for reliability and even power modules are easily achieved.
Z Series Have Full Power Potential
Fewer Z Series connectors are needed in board-to-board sandwich applications compared to traditional connectors. That's less board space, cost, & potential failure points creating a more reliable solution.
Z Series vs.
Simply align & compress the connector between parallel, printed wiring boards or between a printed wiring board and other electronic components.
Reliable electrical continuity eliminates costly soldering processes & inspections while promoting repairability.
Z Series — A Solderless Interconnect Solution
Z Series Features
− Z-axis compression
− 0.050" (1.27mm) contact spacing
− 20 - 175 contacts
− Body heights of .100" - .350" or higher
− Multiple configurations to meet your application needs
− Zero outgassing for space applications
− Capable of withstanding high vibration environments
− Assembled in the USA
Connect with an compression connector expert
AirBorn Solutions Engineers can work with you on your next application design using our Z Series compression interconnect solutions. Please fill out the form below and a member of the AirBorn Team will contact you shortly to learn more about your requirements.
A Solderless Interconnect Solution
Z Series Benefits