Chemical Release Technology

Max Throughput: 25 Wafers Per Cycle

Thermal Stability: ≤ 200°C

Device Thickness*: ~100µm

*Many factors can affect the device thickness. Process optimizations might be necessary.

Mechanical Release

Chemical Release

Thermal Slide

Laser Release

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Laser Release

Mechanical Release

Thermal Slide Release

Chemical Release Technology

Chemical Release

Thermal Slide

Mechanical Release

Laser Release

Turn flat objects into multidimensional, dynamic content by adding a drop shadow. 

Round the corners on images and rectangles. 

Create digestible content and save screen real-estate by condensing lengthy content into categories that can be viewed on separate tabs.

Template - Horizontal Tab Module

1280px x 720px

To replace an image, select the png or jpeg on the canvas or in the layers panel and click the "Replace image" button, which is next to the image thumbnail in the design panel. Any applied animation to the original image will carry over to the new one. 

Tip: How to save time when creating a tab module from scratch.

Max Throughput: 50 Wafers Per Hour

Max Throughput: 20 Wafers Per Hour

Max Throughput: 15 Wafers Per Hour

Max Throughput: 25 Wafers Per Cycle