Chemical Release Technology
Max Throughput: 25 Wafers Per Cycle
Thermal Stability: ≤ 200°C
Device Thickness*: ~100µm
*Many factors can affect the device thickness. Process optimizations might be necessary.
Chemical Release
Thermal Slide
Mechanical Release
Laser Release
Thermal Slide Release
Mechanical Release
Laser Release
Tip: How to save time when creating a tab module from scratch.
Create one tab that has the images, text format, animations, and interactions you want the other tabs in the module to have. Copy and paste the tab and change the names of the pasted tab folders in the layers panel. You can then change the text and images in each tab. This is more efficient than making each tab from scratch.
Round the corners on images and rectangles.
To do this, select an image or rectangle and change the value under "Corner Radius" in the Design tab in the Inspector Panel.
Create digestible content and save screen real-estate by condensing lengthy content into categories that can be viewed on separate tabs.
Template - Horizontal Tab Module
1280px x 720px
Turn flat objects into multidimensional, dynamic content by adding a drop shadow.
To apply a drop shadow, select the shape or image and add a shadow in the design panel. Experiment with the shadow color, blurriness, and position in relation to the asset.
To replace an image, select the png or jpeg on the canvas or in the layers panel and click the "Replace image" button, which is next to the image thumbnail in the design panel. Any applied animation to the original image will carry over to the new one.
Tip: Try to make the new image a similar size and dimension to the image being replaced.
Max Throughput: 15 Wafers Per Hour
Thermal Stability: ≤ 250°C
Device Thickness*: ~50µm
*Many factors can affect the device thickness. Process optimizations might be necessary.
Max Throughput: 20 Wafers Per Hour
Thermal Stability: ≤ 400°C
Device Thickness*: ~30µm
*Many factors can affect the device thickness. Process optimizations might be necessary.
Max Throughput: 50 Wafers Per Hour
Thermal Stability: ≤ 400°C
Device Thickness*: ~10µm
*Many factors can affect the device thickness. Process optimizations might be necessary.