Chemical Debonding
Thermal Slide
Mechanical Debonding
Laser Debonding
Photonic Debonding
Chemical Debonding
Description: In chemical debonding, solvents are used to weaken the adhesive bond between the thinned wafer and the carrier substrate.
Mechanism: The chemicals either degrade the adhesive or induce a reaction that weakens the bond, making it easier to separate the thinned wafer.
Applications: Chemical debonding is commonly used when the device wafers are not ultrathinned and can be processed in a batch method for release.
Thermal Slide
Description: Thermal debonding involves using heat to soften the adhesive bond between the thinned wafer and the carrier substrate.
Mechanism: Elevated temperatures causes the adhesive material to melt or degrade, facilitating the separation of the thinned wafer.
Applications: Thermal debonding is effective for adhesive materials that respond well to temperature changes and applications that do not require ultrathinned device substrates.
Mechanical Debonding
Description: This process involves using mechanical force to separate the thinned wafer from the carrier substrate.
Mechanism: Mechanical debonding methods may include using mechanical blades for initial separation of the bonded pair to physically detach the thinned wafer.
Applications: Mechanical debonding is suitable for wafers that can withstand minimal physical stress without damage.
Laser Debonding
Description: Laser debonding uses laser energy to selectively ablate the adhesive bond between the thinned wafer and the carrier substrate.
Mechanism: The laser is focused on specific regions, generating localized energy to facilitate the debonding process.
Applications: Laser debonding is a preferred debonding method for applications where substrates are being thinned below 20 µm and utilize a very high downstream temperature process where adhesion and TTV control are important.
Photonic Debonding
Description: Photonic debonding uses pulsed broadband light source to debond temporarily bonded wafer pairs by using a light absorbing layer as an inorganic metal release layer.
Mechanism: The flashlamps generate high-intensity pulses of light over short intervals to facilitate debonding.
Applications: Photonic debonding is compatible with thinned device wafers less than 20 µm. It’s often desirable for bonded pairs that may have some slight bow/warp without causing inadequate debonding performance because of its high tolerance for variations in focal distance to the release layer. This release method also does not pose any threat or damage to the device, making it a more competitive option in comparison to laser debonding, and has faster throughput and lower cost of ownership.
Tip: How to save time when creating multiple profile popups.
Create one popup that has the image, text format, animations, and interactions you want each personal profile popup to have. Copy and paste the popup and change the names of the pasted popup folders in the layers panel. Next, edit the text and replace the images in each popup folder. Once completed, each popup will have unique content but a consistent format. This is more efficient than making each popup from scratch.
Hover interactions allow you to reveal or hide folders, objects, or groups when the user hovers their mouse over your specified trigger.
In this template, when the user hovers over an image an opaque shape appears over the image. This hover interaction communicates that an additional interaction will be triggered when the user clicks on the image.
A team profile section can provide insightful information about individuals and their roles within a team or company.
Template - Team Profiles with Popups
1280px x 720px
To add a hover interaction, draw a hotspot over the area you want the user to hover. Select the hotspot and navigate to the Interaction tab in the Inspector Panel. Select “hover” as your trigger and specify the action, which can be: show, hide, show and stay visible, or hide and stay hidden. Finally, choose the folder, object, or group you want to reveal or hide.