Next Generation
Infrared Sensing
(NGIS)
NGIS is a multi-spectral, highly configurable imaging focal plane array. It enables operational overmatch for diverse applications and platforms while simplifying the optical sensor system architecture.
Next Generation Infrared Sensing (NGIS) is a multi-spectral, highly configurable imaging focal plane array (FPA). The broad-spectrum capability delivered by NGIS enables operational overmatch for diverse applications and platforms while simplifying the optical sensor system architecture.
The reconfigurability of NGIS breaks the conventional infrared sensor paradigm of one FPA for one mission. NGIS supports a variety of missions including full spectrum targeting, infrared search and track (IRST), missile warning sensor, intelligence, surveillance, and reconnaissance (ISR), platform situation awareness and support operations in degraded
visual environments.
Focal Plane Array Supports Diverse Missions
NGIS plays an important role in spectrum dominance by providing coverage in nearly any combination of three-color bands across the entire electro-optical and infrared spectrum.
Full Spectrum Dominance Capability
The focal plane has high dynamic range (HDR) imaging capability and can operate over six orders of magnitude flux dynamic range.
HDR imaging is accomplished by using an in-pixel counter for coarse signal digitization followed by a residual analog to digital conversion for fine signal digitization.
Critical Technologies Developed Under NGIS
Several critical technologies are being developed to realize the functionality of the NGIS FPA.
Advanced Detector Processing
The three-color NGIS FPA contains multiple detector layers with a high fill factor, which results in improved effective quantum efficiency. Unique detector processing capabilities developed for NGIS are also essential to manufacturing simultaneous HDR imaging FPAs in the future.
Increased Charge Wells
Conventional readout integrated circuits (ROICs) have limited area and charge storage capacity. Innovative processing methods on the NGIS ROIC have enabled the FPA to achieve a 10X charge storage capacity and dynamic range than originally possible.
Advanced Readout Integrated Circuit (ROIC) Node Design & Die-to-Die Interconnect
The NGIS 3D ROIC design is optimized for reconfigurability and can be tailored to fit new requirements more easily than traditional monolithic ROIC designs due to the unique architecture and advanced ROIC processing technology.
Advanced Detector Processing
Increased Charge Wells
Advanced Readout Integrated Circuit (ROIC) Node Design & Die-to-Die Interconnect
The three-color NGIS FPA contains multiple detector layers with a high fill factor, which results in improved effective quantum efficiency. Unique detector processing capabilities developed for NGIS are also essential to manufacturing simultaneous HDR imaging FPAs in the future.
Advanced Detector Processing
Conventional readout integrated circuits (ROICs) have limited area and charge storage capacity. Innovative processing methods on the NGIS ROIC have enabled the FPA to achieve a 10X charge storage capacity and dynamic range than originally possible.
Increased
Charge Wells
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