Rack and heat densities are rising
Existing thermal solutions are showing limitations
Need to demonstrate energy efficiency improvements
High-performance computing adoption is skyrocketing
As compute power increases, IT equipment generates significant amounts of heat, driving up heat density.
The thermal conductivity properties of air cooling are not enough on their own to keep up with the heat being produced by new IT demands.
Quantifiable improvements must be made to meet sustainability goals.
AI and ML standardization are driving the need for custom solutions to fit each use case.
