Liebert® XD™ Series Applications

Liebert® XDC

Mission-critical cooling systems designed to address higher heat loads from tightly packed electronic rack enclosures. This system does not require any pump, heat exchanger, secondary refrigerant / coolant.

Liebert® XDH

High heat density cooling solution that can be placed directly in line with the rack enclosures and can be implemented as a hybrid approach. This adaptive and scalable design accommodates future provisioning and is available with a Smart Module integrated control board for increased individual module control and monitoring.

Liebert® XDO

Ceiling mounted overhead cooling module that provides sensible spot and zone cooling for high heat density equipment. This flexible, scalable and space-saving product mounts to the ceiling — requiring zero floor space.

Liebert® XDV

Top-mounted cooling module provides sensible spot and zone cooling for high heat density equipment. It can either draw in hot air directly from inside the cabinet or from the hot aisle, and discharge cool air down into the cold aisle where the electronic equipment air inlets are located.

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Liebert® XDP

Pumping unit designed to provide cooling fluid to more than 30kW per rack. The Liebert XDP is an interface between the pumped refrigerant circuit and the building chilled water system.

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Liebert® XDP

Pumping unit designed to provide cooling fluid to more than 30kW per rack. The Liebert XDP is an interface between the pumped refrigerant circuit and the building chilled water system.

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